FGA40N65SMD IGBT — 650V, 40A, field-stop 2nd gen, TO-263 SMD package
The FGA40N65SMD is a 650V, 40A N-channel IGBT from onsemi, built on their 2nd generation field-stop (FS) IGBT technology. This advanced process delivers an optimised balance of low conduction losses and fast switching performance, making it ideal for high-efficiency power conversion applications. The SMD TO-263 (D2PAK) package enables compact, surface-mount power stage designs without sacrificing thermal performance.
With a low saturation voltage of VCE(sat) = 1.9V (typ.) at 40A and a positive temperature coefficient, the FGA40N65SMD is well-suited for parallel operation in high-power designs. It is Pb-free and RoHS compliant.
Key Specifications:
- Part number: FGA40N65SMD
- Type: N-channel IGBT (field-stop, 2nd generation)
- Manufacturer: onsemi (ON Semiconductor)
- Collector-emitter voltage (VCE): 650V
- Continuous collector current (IC): 40A @ 25°C
- Saturation voltage (VCE(sat)): 1.9V typ. @ IC = 40A
- Turn-off energy (EOFF): 6.5 μJ/A (fast switching)
- Maximum junction temperature (TJ): 175°C
- Temperature coefficient: positive (safe for parallel operation)
- Package: TO-263 (D2PAK), surface mount
- Compliance: Pb-free, RoHS compliant
Key Features:
- Field-stop 2nd generation technology — optimised low conduction and switching losses for high-efficiency designs
- Low VCE(sat) = 1.9V — minimal conduction losses at full rated current
- Fast switching (low EOFF) — reduced switching losses at high frequencies
- Positive temperature coefficient — enables safe parallel operation of multiple IGBTs
- TO-263 SMD package — compact surface-mount footprint with good thermal dissipation via PCB copper pour or heatsink pad
- Pb-free and RoHS compliant
Applications:
- Solar inverter switching stages
- UPS (Uninterruptible Power Supply) inverter bridges
- Welding inverters
- Induction heating systems
- Telecom power supplies and ESS (Energy Storage Systems)
- Power Factor Correction (PFC) circuits
Note: The TO-263 tab is electrically connected to the Collector. Adequate PCB copper area or an external heatsink clip is required for thermal management at high currents. Refer to the FGA40N65SMD datasheet for gate drive, SOA, and thermal derating guidelines.