MC TF350 Flux Paste for BGA
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Rs.675.00
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Rs.675.00
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MC TF350 is a professional-grade flux paste engineered for BGA (Ball Grid Array) soldering applications. Formulated with a balanced blend of activators and solvents, it delivers reliable wetting and excellent solder joint quality on fine-pitch components. Ideal for electronics assembly, rework, and repair work where precision and consistency matter. The paste maintains optimal viscosity for controlled application and leaves minimal residue after reflow, reducing cleaning requirements and improving production efficiency.
MC TF350 Flux Paste for BGA
MC TF350 Flux Paste for BGA