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APC2010 IC APC-2010

APC2010 IC Specifications:

  • Category Application General Use
  • Technology Construction Thick Film (Chip)
  • Mounting Packaging Surface Mount Technology (SMT / SMD), 2010, CHIP



APC2010 IC is ideal for most applications requiring high power dissipation in a small-size package.

AlN is an ideal replacement for BeO as it has high power dissipation and no potential environmental hazards.

The “X” designation in each series is a variable that allows for specifying the termination metalization.

These chip resistors have the following features: High stability thick film resistor element AlN substrate material Au (gold) terminations for wire bonding or epoxy attachment PtAg (platinum silver) terminations for epoxy or solder attachment PtAg (platinum silver) with solder coating for solder attachment Standard tolerance 5%, other tolerances available

Available in bulk or on tape and reel

APC2010 IC in pakistan





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