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APC2020 IC APC-2020


APC2020 IC Specifications:

  • Category Application General Use
  • Technology Construction Thick Film (Chip)
  • Mounting Packaging Surface Mount Technology (SMT / SMD), 2010, CHIP

200

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APC2020 IC is ideal for most applications requiring high power dissipation in a small-size package.

AlN is an ideal replacement for BeO as it has high power dissipation and no potential environmental hazards.

The “X” designation in each series is a variable that allows for specifying the termination metalization.

Please see the ordering information on the back for instructions. Thick film technology provides a stable resistor at a very affordable price.

These chip resistors have the following features:

High stability thick film resistor element AlN substrate material Au (gold) terminations for wire bonding or epoxy attachment PtAg (platinum silver) terminations for epoxy or solder attachment PtAg (platinum silver) with solder coating for solder attachment Standard tolerance 5%, other tolerances available Available in bulk or on tape and reel.

apc2020 ic in pakistan

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