EZP2010 USB High Speed Programmer

SOP 16 Pin SMD Socket Specifications:

1. Package Type: SOP (Small Outline Package)
2. Pin Count: 16
3. Mounting Style: Surface Mount Device (SMD)
4. Material: High-quality materials with excellent heat resistance, ensuring durability and reliability in a range of operating conditions.
5. Contact Material: Phosphor Bronze or Beryllium Copper for optimal conductivity and resistance to corrosion.
6. Contact Plating: Gold or Tin plating options, providing a secure and low-resistance connection.
7. Pitch: Standard pitch designed to accommodate SOP 16-pin packages with precision.
8. Socket Body: Sturdy socket body design for mechanical strength and stability.
9. Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation.
10. Operating Temperature Range: Suitable for a wide temperature range, meeting the demands of various applications.
11. Current Rating: Adequate current-carrying capacity to handle the specified SOP 16-pin ICs.
12. RoHS Compliance: Compliant with RoHS directives, ensuring environmental safety.
13. Package Dimensions: Precise dimensions to accommodate the specified SOP 16-pin package size and configuration.
14. Insertion and Extraction Force: Optimized for easy insertion and removal of SOP 16-pin ICs while maintaining a secure connection.
15. Durability: Designed for a high number of insertion and extraction cycles, ensuring long-term reliability.
16. Application: Well-suited for use in testing, prototyping, and development environments where SOP 16-pin ICs need to be replaced or tested frequently.
17. Compatibility: Compatible with a variety of SOP 16-pin ICs from different manufacturers.