The LM339B and LM2901B devices are the next generation versions of the industry-standard LM339 and LM2901 comparator family. These next generation B-version comparators feature lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, and improved 2 kV ESD performance and input ruggedness through dedicated ESD clamps. The LM339B and LM2901B can drop-in replace the LM239, LM339 and LM2901, for both “A” and “V” grades.
IC and IC Sockets
LM2901N DIP-14
LM2901N DIP-14 Features
- Improved specifications of B-version
- Maximum rating: up to 38 V
- ESD rating (HBM): 2k V
- Low input offset: 0.37 mV
- Low input bias current: 3.5 nA
- Low supply-current: 200 µA per comparator
- Faster response time of 1 µsec
- Extended temperature range for LM339B
- B-version is drop-in replacement for LM239, LM339 and LM2901, A and V versions
- Common-mode input voltage range includes ground
- Differential input voltage range equal to maximum-rated supply voltage: ±38 V
- The low output saturation voltage
- Output compatible with TTL, MOS, and CMOS
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LM393 SOP-8 IC
0 out of 5(0)LM393 SOP-8 IC Features:
- Wide Single-Supply Range: 2.0 Vdc to 36 Vdc
- Split-Supply Range: ±1.0 Vdc to ±18 Vdc
- Very Low Current Drain Independent of Supply Voltage: 0.4 mA
- Low Input Bias Current: 25 nA
- Low Input Offset Current: 5.0 nA
- Low Input Offset Voltage: 5.0 mV (max) LM293/393
- Input Common Mode Range to Ground Level
- Differential Input Voltage Range Equal to Power Supply Voltage
- Output Voltage Compatible with DTL, ECL, TTL, MOS, and CMOS Logic Levels
- ESD Clamps on the Inputs Increase the Ruggedness of the Device without Affecting Performance
- NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100
- Qualified and PPAP Capable
- These Devices are Pb-Free, Halogen Free/BFR Free and RoHS Compliant
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0 out of 5(0)Max232 IC Features
- RS-232 Bus-Terminal ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM) - Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU V.28 Standards
- Operates With 3-V to 5.5-V VCC Supply
- Operates up to 250 kbit/s
- Two Drivers and Two Receivers
- Low Supply Current: 300 µA Typical
- External Capacitors: 4 × 0.1 µF
- Accepts 5-V Logic Input With 3.3-V Supply
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- SN65C3232 (–40°C to 85°C)
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Round Socket 14-Pin
0 out of 5(0)Round Socket 14 Pin Specifications:
- Pin Count: 14
- Package Type: Round Socket
- Material: High-quality, durable materials selected for their mechanical strength and resistance to environmental factors.
- Contact Material: Phosphor Bronze or Beryllium Copper, chosen for optimal conductivity and corrosion resistance.
- Contact Plating: Gold or Tin plating options to ensure a reliable and low-resistance electrical connection.
- Socket Body: Sturdy and ergonomic design to provide mechanical stability and ease of use.
- Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation between pins.
- Mounting Style: Designed for through-hole mounting on PCBs, ensuring a secure and stable connection.
- Pitch: Standard pitch to accommodate 14-pin IC packages with precision.
- Operating Temperature Range: Suitable for a broad temperature range to meet various environmental conditions.
- Current Rating: Adequate current-carrying capacity to handle the specified ICs.
- RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) directives for environmental safety.
- Package Dimensions: Precise dimensions to accommodate the specified 14-pin IC package size and configuration.
- Insertion and Extraction Force: Optimized for easy insertion and removal of ICs while maintaining a secure connection.
- Durability: Engineered for a high number of insertion and extraction cycles to ensure long-term reliability.
- Application: Well-suited for use in various electronic devices, prototyping projects, and applications where IC replacement or testing is frequent.
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Socket 8-Pin
0 out of 5(0)Socket 8 Pin Specifications:
- Pin Count: 8
- Mounting Style: Through-hole or Surface Mount Device (SMD), depending on application requirements.
- Material: High-quality, durable materials to ensure mechanical strength and reliability in various operating conditions.
- Contact Material: Phosphor Bronze or Beryllium Copper for excellent electrical conductivity and resistance to corrosion.
- Contact Plating: Gold or Tin plating options to maintain a secure and low-resistance connection.
- Pitch: Standard pitch to accommodate 8-pin IC packages with precision.
- Socket Body: Robust design for mechanical stability and ease of handling during insertion and extraction of ICs.
- Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation between pins.
- Operating Temperature Range: Suitable for a wide temperature range to meet diverse application requirements.
- Current Rating: Adequate current-carrying capacity to handle the specified ICs.
- RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) directives for environmental safety.
- Package Dimensions: Precise dimensions to accommodate the specified 8-pin IC package size and configuration.
- Insertion and Extraction Force: Optimized for easy insertion and removal of ICs while maintaining a secure connection.
- Durability: Designed for a high number of insertion and extraction cycles to ensure long-term reliability.
- Application: Suitable for use in various electronic circuits, prototyping boards, and test setups where 8-pin ICs are employed.
- Compatibility: Compatible with a range of 8-pin ICs from different manufacturers, offering versatility in circuit designs.
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