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Round Socket 40 Pin Specifications:

1. Connector Type: Round Socket
2. Pin Count: 40
3. Form Factor: Circular, offering a unique and space-efficient design.
4. Mounting Style: Suitable for through-hole mounting on PCBs, providing stability and secure connections.
5. Material: High-quality materials for durability and resistance to environmental factors.
6. Contact Material: Phosphor Bronze or Beryllium Copper for excellent conductivity and corrosion resistance.
7. Contact Plating: Gold or Tin plating options available to ensure reliable and low-resistance connections.
8. Pitch: Standard pitch for compatibility with a variety of components and ICs.
9. Socket Body: Robust construction for mechanical strength and stability.
10. Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation.
11. Operating Temperature Range: Suitable for a broad temperature range to accommodate various operating conditions.
12. Current Rating: Adequate current-carrying capacity to handle the specified components.
13. RoHS Compliance: Compliant with RoHS directives for environmental safety.
14. Package Dimensions: Precise dimensions to accommodate the specified 40-pin configuration.
15. Insertion and Extraction Force: Optimized for easy insertion and removal while maintaining a secure connection.
16. Durability: Designed for a high number of insertion and extraction cycles to ensure long-term reliability.
17. Application: Ideal for use in a variety of electronic devices, including development boards, industrial equipment, and custom electronic projects.
18. Compatibility: Versatile design for compatibility with a range of 40-pin components, facilitating broad applicability.

Round Socket 8 Pin Specifications:

• Socket Type: Round Socket
• Pin Count: 8
• Package Compatibility: Designed to accommodate 8-pin round-shaped ICs.
• Mounting Style: Suitable for surface mounting on PCBs.
• Material: High-quality materials with heat-resistant properties for enhanced durability.
• Contact Material: Phosphor Bronze or Beryllium Copper, ensuring excellent conductivity and corrosion resistance.
• Contact Plating: Gold or Tin plating options for a reliable and low-resistance connection.
• Pitch: Standard pitch to match the specifications of 8-pin round IC packages.
• Socket Body: Robust design for mechanical strength and stability.
• Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation.
• Operating Temperature Range: Wide temperature range compatibility for diverse application environments.
• Current Rating: Adequate current-carrying capacity to handle the specified 8-pin round ICs.
• RoHS Compliance: Compliant with RoHS directives for environmental safety.
• Package Dimensions: Precise dimensions to accommodate the specified 8-pin round IC package size and configuration.
• Insertion and Extraction Force: Optimized for easy insertion and removal of 8-pin round ICs while maintaining a secure connection.
• Durability: Engineered for a high number of insertion and extraction cycles to ensure long-term reliability.
• Application: Well-suited for prototyping, testing, and development environments where easy replacement or testing of 8-pin round ICs is required.

• Compatibility: Designed to be compatible with a variety of 8-pin round ICs from different manufacturers.