IC and IC Sockets
TL082CP DIP-8
TL082CP Features:
- High slew rate: 20 V/µs (TL08xH, typ)
- Low offset voltage: 1 mV (TL08xH, typ)
- Low offset voltage drift: 2 µV/°C
- Low power consumption: 940 µA/ch (TL08xH, typ)
- Wide common-mode and differential voltage ranges
- Common-mode input voltage range includes VCC+
- Low input bias and offset currents
- Low noise: Vn = 18 nV/√Hz (typ) at f = 1 kHz
- Output short-circuit protection
- Low total harmonic distortion: 0.003% (typ)
- Wide supply voltage: ±2.25 V to ±20 V, 4.5 V to 40 V
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TL082CP is the next-generation version of the industry-standard TL08x (TL081, TL082, and TL084) devices. These devices provide outstanding value for cost-sensitive applications, with features including low offset (1 mV, typical), high slew rate (20 V/µs), and common-mode input to the positive supply. High ESD (1.5 kV, HBM), integrated EMI and RF filters, and operation across the full –40°C to 125°C enable the TL08xH devices to be used in the most rugged and demanding applications.
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- Pin Count: 40
- Package Compatibility: Designed to accommodate a wide range of 40-pin IC packages, including DIP (Dual Inline Package) and other standard configurations.
- Mounting Style: Suitable for both through-hole mounting for secure PCB attachment.
- Material: High-quality materials selected for durability and resistance to environmental factors.
- Contact Material: Phosphor Bronze or Beryllium Copper, providing excellent electrical conductivity and corrosion resistance.
- Contact Plating: Gold or Tin plating options available to ensure a reliable and low-resistance connection.
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- Operating Temperature Range: Wide temperature range to meet various application requirements.
- Current Rating: Adequate current-carrying capacity to handle the specified 40-pin ICs.
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Socket 8 Pin Specifications:
- Pin Count: 8
- Mounting Style: Through-hole or Surface Mount Device (SMD), depending on application requirements.
- Material: High-quality, durable materials to ensure mechanical strength and reliability in various operating conditions.
- Contact Material: Phosphor Bronze or Beryllium Copper for excellent electrical conductivity and resistance to corrosion.
- Contact Plating: Gold or Tin plating options to maintain a secure and low-resistance connection.
- Pitch: Standard pitch to accommodate 8-pin IC packages with precision.
- Socket Body: Robust design for mechanical stability and ease of handling during insertion and extraction of ICs.
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- Package Compatibility: Designed to accommodate a variety of 16-pin IC packages, ensuring broad applicability.
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- Material: High-quality materials chosen for durability, electrical conductivity, and resistance to environmental factors.
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- Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation between pins.
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- Package Dimensions: Precise dimensions to accommodate the specified 16-pin IC package size and configuration.
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- SOT23-5 package
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