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SOP 20-Pin SMD Socket

SOP 20 Pin SMD Socket Specifications:

  1. Package Type: SOP (Small Outline Package)
  2. Pin Count: 20
  3. Mounting Style: Surface Mount Device (SMD)
  4. Material: High-quality, heat-resistant materials chosen for durability and reliability in various operating conditions.
  5. Contact Material: Phosphor Bronze or Beryllium Copper, providing excellent conductivity and resistance to corrosion.
  6. Contact Plating: Gold or Tin plating options to ensure a secure, low-resistance connection.
  7. Pitch: Standard pitch to accommodate SOP packages with precision.
  8. Socket Body: Robust socket body design for mechanical strength and stability during IC installation and removal.
  9. Socket Insulation: Insulating material prevents short circuits and ensures electrical isolation between pins.
  10. Operating Temperature Range: Suitable for a wide temperature range to meet the demands of diverse applications.
  11. Current Rating: Adequate current-carrying capacity to handle the specified SOP 20-pin ICs.
  12. RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) directives for environmental safety.
  13. Package Dimensions: Precise dimensions to accommodate the specified SOP 20-pin package size and configuration.
  14. Insertion and Extraction Force: Optimized for easy insertion and removal of SOP 20-pin ICs while maintaining a secure connection.
  15. Durability: Designed for a high number of insertion and extraction cycles to ensure long-term reliability.
  16. Application: Ideal for use in prototyping, testing, and development environments where frequent replacement or testing of SOP 20-pin ICs is required.
  17. Compatibility: Compatible with a variety of SOP 20-pin ICs from different manufacturers.



SOP 20 Pin SMD Socket is a purpose-built socket designed to accommodate integrated circuits (ICs) packaged in SOP format with 20 pins. This socket offers a reliable and convenient solution for mounting SOP 20-pin devices onto printed circuit boards (PCBs) without the need for soldering. Its compact design and high-quality construction make it well-suited for applications requiring flexibility in IC installation and removal.


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