IC and IC Sockets
TL084C SOP-14
TL084C Features:
- High slew rate: 20 V/µs (TL08xH, typ)
- Low offset voltage: 1 mV (TL08xH, typ)
- Low offset voltage drift: 2 µV/°C
- Low power consumption: 940 µA/ch (TL08xH, typ)
- Wide common-mode and differential voltage ranges
- Common-mode input voltage range includes VCC+
- Low input bias and offset currents
- Low noise: Vn = 18 nV/√Hz (typ) at f = 1 kHz
- Output short-circuit protection
- Low total harmonic distortion: 0.003% (typ)
- Wide supply voltage: ±2.25 V to ±20 V, 4.5 V to 40 V
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TL084C is the next-generation version of the industry-standard TL08x (TL081, TL082, and TL084) devices. These devices provide outstanding value for cost-sensitive applications, with features including low offset (1 mV, typical), high slew rate (20 V/µs), and common-mode input to the positive supply. High ESD (1.5 kV, HBM), integrated EMI and RF filters, and operation across the full –40°C to 125°C enable the TL08xH devices to be used in the most rugged and demanding applications.
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- Very Low Current Drain Independent of Supply Voltage: 0.4 mA
- Low Input Bias Current: 25 nA
- Low Input Offset Current: 5.0 nA
- Low Input Offset Voltage: 5.0 mV (max) LM293/393
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- Differential Input Voltage Range Equal to Power Supply Voltage
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- NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100
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- Pin Count: 8
- Mounting Style: Through-hole or Surface Mount Device (SMD), depending on application requirements.
- Material: High-quality, durable materials to ensure mechanical strength and reliability in various operating conditions.
- Contact Material: Phosphor Bronze or Beryllium Copper for excellent electrical conductivity and resistance to corrosion.
- Contact Plating: Gold or Tin plating options to maintain a secure and low-resistance connection.
- Pitch: Standard pitch to accommodate 8-pin IC packages with precision.
- Socket Body: Robust design for mechanical stability and ease of handling during insertion and extraction of ICs.
- Socket Insulation: Insulating material to prevent short circuits and ensure electrical isolation between pins.
- Operating Temperature Range: Suitable for a wide temperature range to meet diverse application requirements.
- Current Rating: Adequate current-carrying capacity to handle the specified ICs.
- RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) directives for environmental safety.
- Package Dimensions: Precise dimensions to accommodate the specified 8-pin IC package size and configuration.
- Insertion and Extraction Force: Optimized for easy insertion and removal of ICs while maintaining a secure connection.
- Durability: Designed for a high number of insertion and extraction cycles to ensure long-term reliability.
- Application: Suitable for use in various electronic circuits, prototyping boards, and test setups where 8-pin ICs are employed.
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- Compatibility: Specifically designed for use with Super Pro programmers.
- Material: High-quality materials for durability and longevity.
- Connector Type: DIP (Dual In-line Package) for straightforward integration with programmable devices.
- Pitch: Standard 2.54mm pitch for compatibility with various IC packages.
- Locking Mechanism: Secure locking mechanism to ensure proper connection during programming.
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Specifications:
- Pin Count: 40 pins – Accommodates a variety of integrated circuits.
- ZIF Design: Zero Insertion Force mechanism for effortless and safe IC handling.
- Pitch: Standard 2.54mm pitch – Compatible with various IC packages.
- Material: High-quality materials ensure durability and reliability.
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- Operating Temperature Range: Suitable for a wide range of environmental conditions.
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